Series |
MAX® 10 |
Package |
Tray |
Product Status |
Active |
Number of LABs/CLBs |
250 |
Number of Logic Elements/Cells |
4000 |
Total RAM Bits |
193536 |
Number of I/O |
246 |
Voltage - Supply |
1.15V ~ 1.25V |
Mounting Type |
Surface Mount |
Operating Temperature |
0°C ~ 85°C (TJ) |
Package / Case |
324-LFBGA |
Supplier Device Package |
324-UBGA (15x15) |
Description
Technology
55 nm TSMC Embedded Flash (Flash + SRAM) process technology
Packaging
• Low cost, small form factor packages—support multiple packaging
technologies and pin pitches
• Multiple device densities with compatible package footprints for seamless
migration between different device densities
• RoHS6-compliant
Core architecture
• 4-input look-up table (LUT) and single register logic element (LE)
• LEs arranged in logic array block (LAB)
• Embedded RAM and user flash memory
• Clocks and PLLs
• Embedded multiplier blocks
• General purpose I/Os
Internal memory blocks
• M9K—9 kilobits (Kb) memory blocks
• Cascadable blocks to create RAM, dual port, and FIFO functions
User flash memory (UFM)
• User accessible non-volatile storage
• High speed operating frequency
• Large memory size
• High data retention
• Multiple interface option
Embedded multiplier blocks
• One 18 × 18 or two 9 × 9 multiplier modes
• Cascadable blocks enabling creation of filters, arithmetic functions, and image
processing pipelines
ADC
• 12-bit successive approximation register (SAR) type
• Up to 17 analog inputs
• Cumulative speed up to 1 million samples per second ( MSPS)
• Integrated temperature sensing capability
Clock networks
• Global clocks support
• High speed frequency in clock network
Internal oscillator
Built-in internal ring oscillator
PLLs
• Analog-based
• Low jitter
• High precision clock synthesis
• Clock delay compensation
• Zero delay buffering
• Multiple output taps
General-purpose I/Os (GPIOs)
• Multiple I/O standards support
• On-chip termination (OCT)
• Up to 720 megabits per second (Mbps) LVDS receiver and transmitter
External memory interface (EMIF) (1)
Supports up to 600 Mbps external memory interfaces:
• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)
• SRAM (Hardware support only)
PAYMENT TERMS
● We accept PayPal, Trade Assurance, MonryGram, Western Union and Bank T/T
● FOB price, not including shipping cost and trading charges.
● The buyers should be responsible for the trading charges.
SHIPPING TERMS
● We will pack and send your goods within 1-3 working days after we confirmed your payment.
● We will inform you the lead time if we have to purchase from manufactory.
● We usually ship by DHL, EMS , UPS, TNT, FedEx, or Aramex . It usually takes 3-5 days to arrive.China Post smallpacket and sea shipping are aslo optional,But the time is slow, suitable for samples and large quantities of goods.
● We are not responsible for any accidents, delays or other situations related with shipping company. But we will keep focus on the package tracking.
● Tracking number will be shared with you when we got it from the logistics company.
http://www.xiannengic.com/